DDR5 SMT TYPE

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DDR5 SMT TYPE

DDR5 provides higher transmission speed and less space than DDR4.
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DDR DEVELOPMENT
_COMPARATION
^{DDR4 & DDR5}
DDR4
_{Seating Place}
2.4 mm MAX
DIMM Card Thickness
1.4 +/-0.10 mm
_{Transmission rate}
3.2 G
_Voltage
1.2 V
★
DDR5
_{Seating Place}
2.0 mm MAX
DIMM Card Thickness
1.27 +/-0.10 mm
_{Transmission rate}
6.4 G
_Voltage
1.1 V
DDR5 TYPE

DDR5 FOR R/LR DIMM
D=3.875

DDR5 FOR UDIMM
D=1.425

DDR5 APPLICATION
DDR5 will be widely used in the following fields as it has the faster
transmission speed:
➊ Personal PC and server
➋ Large data processing center
➌ Artificial intelligence technology and machine learning cloud technology, Internet
➍ lock chain
➎ Virtualization and AR/VR/MR Solutions
➏ Monitoring system

PRODUCT STRUCTURE CHARACTERISTICS
Structure features: The terminal is fixed by injection molding , and then put the molding into the housing body, to avoid the terminal directly into the housing body cause the deformation. Solved the product in SMT process welding issue .
BEFORE AND AFTER IR

Different processes are used to ensure the flatness of products before and after IR and excellent solder performance, and ensure the stability of solder in SMT process.

SOLDERING STATUS

After Soldering
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PRODUCT SPECIFICATIONS

MATERIAL
_Contacts
Copper alloy, Gold flash or 15 µin min. of gold or 30 µin min. of gold (Contact area), matte tin plating(Solder Area), Nickel plating over all (Underplate)
_{Insulator & Latch}
High temperature, thermal plastic (UL94V-0), color option.
_Boardlock
Stainless steel, Tin plating ,Nickel plating overall (Underplate)
ENVIRONMENTAL
_{Solderability}
95% min.
_{Resistance to Soldering Heat}
Visual-no damage or discoloration of connector materials Temperature Life, Thermal Shock, Cycling Temperature and Humidity
_{Temperature Rise}
30°C max.

Mixed Flowing Gas, Thermal Disturbance, Salt Spray
SPECIFICATIONS
_{JEDEC Module Outlines}
MO-329
_{JEDEC Socket Outlines}
SO-023
PACKAGING
Tray
ELECTRICAL PERFORMANCE
_{Voltage Rating}
29V AC (RMS)/DC Current
_Rating
0.75 Amps/pin max.
_{Low Level Contact Resistance (max.)}
30 milliohm
_{Dielectric Withstanding Voltage}
500V AC Insulation
_{Resistance (min.)}
100 Megohm
MECHANICAL PERFORMANCE
_{Insertion Force}
106.8N max.
_{Withdrawal Force}
19.77N min.
_{Retention Force}
Contact: 300gf min. per pin
Boardlock: 13.3N min.
_Durability
25 cycles Vibration, Mechanical Shock
_{Latch Overstress Force}
3.5kg min. force held for 10s with no damage
_Reseating
No damage
_{Latch Actuation Force}
The force to fully actuate the latch open shall be 4.5kgf max. per latch
_{Module Rip Out Force}
9.1kgf min. retention force of the module in connector with no damage
_{Retention of Connector to PCB}
No lifting of connector from applicable PCB
_{Total Insertion Force}
75N max
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DDR5 SI SPEC.

SI TESTING
Anritsu ShockLine™ MS46524B(Vector Network AnalyzersVNA)
4 Ports
TDR options(time domain)
50 kHz — 43.5 GHz(frequency domain)
TOSLKF50A-40 (cal kit)

SI TESTING RESULT
DDR5 SI Require transmission 6.4G Pitch=0.85mm
PCB PAD Width 0.52mm

2D DRAWING
PATENT CERTIFICATION

USA
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DDR5 SMT TYPE

PCI 5.0 SMT TYPE
▌Home > Products > DDR5 SMT Type

▂▂

DDR DEVELOPMENT

COMPARATION

DDR4 & DDR5

DDR4

Seating Place

2.4 mm MAX

DIMM Card Thickness

1.4 +/-0.10 mm

Transmission rate

3.2 G

Voltage

1.2 V

DDR5

Seating Place

2.0 mm MAX

DIMM Card Thickness

1.27 +/-0.10 mm

Transmission rate

6.4 G

Voltage

1.1 V

DDR5 TYPE

DDR5 FOR R/LR DIMMD=3.875

DDR5 FOR UDIMMD=1.425

DDR5 APPLICATION

DDR5 will be widely used in the following fields as it has the fastertransmission speed:

BEFORE AND AFTER IR

SOLDERING STATUS

After Soldering

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PRODUCT SPECIFICATIONS

MATERIAL

Contacts

Insulator & Latch

Boardlock

ENVIRONMENTAL

Solderability

Resistance to Soldering Heat

Temperature Rise

SPECIFICATIONS

JEDEC Module Outlines

JEDEC Socket Outlines

PACKAGING

ELECTRICAL PERFORMANCE

Voltage Rating

Rating

Low Level Contact Resistance (max.)

Dielectric Withstanding Voltage

Resistance (min.)

MECHANICAL PERFORMANCE

Insertion Force

Withdrawal Force

Retention Force

Durability

Latch Overstress Force

Reseating

Latch Actuation Force

Module Rip Out Force

Retention of Connector to PCB

Total Insertion Force

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DDR5 SI SPEC.

SI TESTING

SI TESTING RESULT

2D DRAWING

PATENT CERTIFICATION

USA

▂▂MORE PRODUCTS...

_COMPARATION

^{DDR4 & DDR5}

_{Seating Place}

_{Transmission rate}

_Voltage

_{Seating Place}

_{Transmission rate}

_Voltage

DDR5 FOR R/LR DIMM
D=3.875

DDR5 FOR UDIMM
D=1.425

DDR5 will be widely used in the following fields as it has the faster
transmission speed:

_Contacts

_{Insulator & Latch}

_Boardlock

_{Solderability}

_{Resistance to Soldering Heat}

_{Temperature Rise}

_{JEDEC Module Outlines}

_{JEDEC Socket Outlines}

_{Voltage Rating}

_Rating

_{Low Level Contact Resistance (max.)}

_{Dielectric Withstanding Voltage}

_{Resistance (min.)}

_{Insertion Force}

_{Withdrawal Force}

_{Retention Force}

_Durability

_{Latch Overstress Force}

_Reseating

_{Latch Actuation Force}

_{Module Rip Out Force}

_{Retention of Connector to PCB}

_{Total Insertion Force}

▂▂
MORE PRODUCTS...
　